Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088169 | Integrated assemblies having thicker semiconductor material along one region of a conductive structure than along another region, and methods of forming integrated assemblies | — | 2021-08-10 |
| 11081495 | Integrated structures | Justin B. Dorhout, David Daycock, Martin C. Roberts, Yushi Hu | 2021-08-03 |
| 10998326 | Integrated assemblies and methods of forming integrated assemblies | Justin B. Dorhout, Martin C. Roberts, Mohd Kamran Akhtar, Chet E. Carter, David Daycock | 2021-05-04 |
| 10978386 | Microelectronic devices with through-silicon vias and associated methods of manufacturing | Kyle K. Kirby, Philip J. Ireland, Sarah A. Niroumand | 2021-04-13 |
| 10971683 | Methods for forming narrow vertical pillars and integrated circuit devices having the same | Jun Liu | 2021-04-06 |
| 10903220 | Integrated assemblies having anchoring structures proximate stacked memory cells, and methods of forming integrated assemblies | Justin B. Dorhout, Nancy M. Lomeli | 2021-01-26 |