Issued Patents 2021
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201157 | Bonded semiconductor devices having processor and static random-access memory and methods for forming the same | — | 2021-12-14 |
| 11189828 | Lithium metal pouch cells and methods of making the same | Jie Xiao, Hongkyung Lee, Dianying Liu, Chaojiang Niu | 2021-11-30 |
| 11183488 | Three-dimensional memory devices with stacked device chips using interposers | Li Xiao | 2021-11-23 |
| 11177795 | Master latch design for single event upset flip-flop | Bruce Young | 2021-11-16 |
| 11164633 | Memory device using comb-like routing structure for reduced metal line loading | Zongliang Huo, Zhiliang Xia, Li Xiao | 2021-11-02 |
| 11158604 | Unified semiconductor devices having processor and heterogeneous memories and methods for forming the same | Weihua Cheng | 2021-10-26 |
| 11158796 | Resistance variable memory device with nanoparticle electrode and method of fabrication | Kristy A. Campbell | 2021-10-26 |
| 11152277 | Three-dimensional memory devices having hydrogen blocking layer and fabrication methods thereof | — | 2021-10-19 |
| 11133293 | Three-dimensional memory device with three-dimensional phase-change memory | — | 2021-09-28 |
| 11133465 | Methods for forming three-dimensional phase-change memory devices | — | 2021-09-28 |
| 11121150 | Three-dimensional memory devices and fabricating methods thereof | Li Xiao | 2021-09-14 |
| 11063215 | Spacial arrangments of and critical dimensions for bit line contacts of three-dimensional phase-change memory devices | — | 2021-07-13 |
| 11062771 | Variable resistance memory with lattice array using enclosing transistors | — | 2021-07-13 |
| 11056454 | Stacked three-dimensional heterogeneous memory devices and methods for forming the same | — | 2021-07-06 |
| 11050019 | Memory devices including phase change material elements | — | 2021-06-29 |
| 11037946 | Three-dimensional memory devices and methods for forming the same | — | 2021-06-15 |
| 11031377 | Integration of three-dimensional NAND memory devices with multiple functional chips | — | 2021-06-08 |
| 11024600 | Unified semiconductor devices having programmable logic device and heterogeneous memories and methods for forming the same | Weihua Cheng | 2021-06-01 |
| 10991759 | Methods of forming vertical field-effect transistor with selfaligned contacts for memory devices with planar periphery/array and intermediate structures formed thereby | Sanh D. Tang, David H. Wells | 2021-04-27 |
| 10984862 | Three-dimensional memory device with embedded dynamic random-access memory | — | 2021-04-20 |
| 10971683 | Methods for forming narrow vertical pillars and integrated circuit devices having the same | Kunal R. Parekh | 2021-04-06 |
| 10971517 | Source contact structure of three-dimensional memory devices and fabrication methods thereof | Yi Liu, Lu Fan | 2021-04-06 |
| 10963613 | Partial reconfiguration of integrated circuits using shell representation of platform design with extended routing region | Meiwei Wu, Raymond Kong | 2021-03-30 |
| 10937766 | Three-dimensional memory device with three-dimensional phase-change memory | — | 2021-03-02 |
| 10892275 | Stacked connections in 3D memory and methods of making the same | Zongliang Huo | 2021-01-12 |