Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145797 | Forming conformable layer with flap on semiconductor devices | Tilman Zehender, Pooya Saketi, Karsten Moh | 2021-10-12 |
| 11107948 | Fluidic pick-up head for assembling light emitting diodes | Yigit Menguc, Pooya Saketi, Thomas John Farrell Wallin, Nicholas Roy Corson, Ali Sengül +5 more | 2021-08-31 |
| 11101159 | Pickup head with photocurable polymers for assembling light emitting diodes | Daniel Brodoceanu, Ali Sengül, Pooya Saketi | 2021-08-24 |
| 11011687 | Micro light emitting diode with remnants of fabrication substrate for structural support | Allan Pourchet, Pooya Saketi, Daniel Brodoceanu | 2021-05-18 |
| 11005014 | Optics formation using pick-up tools | Daniel Brodoceanu, Patrick J. Hughes, Pooya Saketi | 2021-05-11 |
| 10998480 | Light-emitting structure alignment preservation in display fabrication | — | 2021-05-04 |
| 10998286 | Laser-induced selective heating for microLED placement and bonding | Daniel Brodoceanu, Allan Pourchet | 2021-05-04 |
| 10989735 | Atomic force microscopy tips for interconnection | Ali Sengül, Zheng Sung Chio, Pooya Saketi, Daniel Brodoceanu | 2021-04-27 |
| 10964581 | Self-aligned adhesive layer formation in light-emitting structure fabrication | — | 2021-03-30 |
| 10964867 | Using underfill or flux to promote placing and parallel bonding of light emitting diodes | Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick J. Hughes, Alexander Udo May +1 more | 2021-03-30 |