Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11145797 | Forming conformable layer with flap on semiconductor devices | Oscar Torrents Abad, Tilman Zehender, Pooya Saketi | 2021-10-12 | $200,040,000 |
| 10964867 | Using underfill or flux to promote placing and parallel bonding of light emitting diodes | Daniel Brodoceanu, Thiago Martins Amaral, Pooya Saketi, Patrick J. Hughes, Alexander Udo May +1 more | 2021-03-30 | $212,745,000 |
| 10941035 | Method for producing structured surfaces | Johannes H. M. Maurer, Tobias Kraus, Lola González-García, Beate Reiser, Ioannis Kanelidis +2 more | 2021-03-09 | |
| 10910514 | Molded etch masks | Daniel Brodoceanu, David Massoubre | 2021-02-02 | $155,827,000 |