YJ

Yan-Liang Ji

ME Mediatek: 1 patents #154 of 426Top 40%
📍 Yichun City, PA: #1 of 1 inventorsTop 100%
Overall (2021): #205,785 of 548,734Top 40%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10998267 Wafer-level chip-size package with redistribution layer Ming-Jen Hsiung 2021-05-04