MH

Ming-Jen Hsiung

ME Mediatek: 1 patents #154 of 426Top 40%
📍 Zhubei City, TW: #70 of 214 inventorsTop 35%
Overall (2021): #332,967 of 548,734Top 65%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10998267 Wafer-level chip-size package with redistribution layer Yan-Liang Ji 2021-05-04