Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11208554 | Thermally-conductive resin composition, and complex comprising same | Jee Kwon PARK, Yeong Deuk SEO, Jung Ki Kim, Sang Hyun Hong | 2021-12-28 |
| 10998477 | Polyester resin composition having improved mechanical properties and moldability | Tae Gon Kang, Chan Moo PARK, Jong Cheol Lim, Sang Hyun Hong, Tae-Soo Kim +1 more | 2021-05-04 |
| 10899900 | Thermoplastic resin composition for laser direct structuring, and molded article comprising same | Ik Mo Kim, Jung Ki Kim, Jee Kwon PARK, Sang Hyun Hong | 2021-01-26 |