Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11208554 | Thermally-conductive resin composition, and complex comprising same | Jee Kwon PARK, Jung Ki Kim, Yoo Jin Jung, Sang Hyun Hong | 2021-12-28 |
| 11091634 | Thermoplastic resin composition and molded product produced therefrom | Kyoung Tae Youm, Sang Hyun Hong | 2021-08-17 |