Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11142669 | Adhesive and method of encapsulating organic electronic device using the same | Hyun Jee Yoo, Yoon Gyung Cho, Jung Sup Shim, Suk Chin Lee, Kwang-Jin Jeong | 2021-10-12 |
SC
Suk Ky Chang
Overall (2021): #247,705 of 548,734Top 50%
1
Patents 2021