Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11142669 | Adhesive and method of encapsulating organic electronic device using the same | Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim, Suk Chin Lee, Kwang-Jin Jeong | 2021-10-12 |
| 10937990 | Encapsulation film | Hyun Suk Kim, Jung Ok Moon, Se Woo Yang, Jae Jin Kim, Dae Han Seo +2 more | 2021-03-02 |
| 10910594 | Encapsulation film | Jung Woo Lee, Hyun Suk Kim, Jung Ok Moon, Se Woo Yang | 2021-02-02 |