Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11176259 | Authentication circuit, electronic system including the same, and method of forming network | Jae Won Lee, Junho Huh | 2021-11-16 |
| 11133287 | Semiconductor package including stacked semiconductor chips and method for fabricating the same | — | 2021-09-28 |
| 11133288 | Semiconductor package including stacked semiconductor chips | — | 2021-09-28 |
| 11123337 | 4-methylsulfonyl-substituted piperidine urea compounds | Johan D. Oslob, Danielle Aubele, Robert McDowell, Yonghong Song, Arvinder Sran +1 more | 2021-09-21 |
| 11118021 | Fiber-reinforced polypropylene-based composite resin composition with reduced odor for interior parts of automobiles | Han Ki Lee, Ju Seong Park, Byung Soo Kim, Byung Wook Kang | 2021-09-14 |
| 11114850 | Electrostatic discharge protection circuit | Jae Hyun Lee, Yong Nam Choi | 2021-09-07 |
| 11049741 | Systems for integrated decomposition and scanning of a semiconducting wafer | Tyler Yost, Daniel R. Wiederin, Beau A. Marth, Jared Kaser, Jonathan Hein +2 more | 2021-06-29 |