Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049741 | Systems for integrated decomposition and scanning of a semiconducting wafer | Tyler Yost, Daniel R. Wiederin, Jared Kaser, Jonathan Hein, Jae Seok Lee +2 more | 2021-06-29 |