Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923452 | Substrate bonding apparatus | Ilyoung Han, Taeyeong Kim, Jihoon Kang, Nohsung Kwak, Seokho Kim +2 more | 2021-02-16 |
HL
Hakjun Lee
Overall (2021): #440,088 of 548,734Top 85%
1
Patents 2021