Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127776 | Hybrid bonding method for semiconductor wafers and related three-dimensional integrated device | Giovanni De Amicis, Andrea Del Monte | 2021-09-21 |
| 11081614 | Integrated sensor of ionizing radiation and ionizing particles | Angelo Rivetti, Lucio Pancheri, Piero Giubilato, Manuel Dionisio Da Rocha Rolo, Giovanni Margutti | 2021-08-03 |