Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127776 | Hybrid bonding method for semiconductor wafers and related three-dimensional integrated device | Giovanni De Amicis, Onorato Di Cola | 2021-09-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127776 | Hybrid bonding method for semiconductor wafers and related three-dimensional integrated device | Giovanni De Amicis, Onorato Di Cola | 2021-09-21 |