Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164843 | Substrate bonding apparatus | Yoshiharu Ono | 2021-11-02 |
| 10915018 | Imprinting system, method of manufacturing semiconductor device, and recording medium | Takahito Nishimura, Yoshihisa Kawamura, Kiminori Yoshino, Suigen Kanda | 2021-02-09 |