Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189550 | Low-cost semiconductor package using conductive metal structure | In Suk Choi | 2021-11-30 |
| 11171074 | Heat sink board, manufacturing method thereof, and semiconductor package including the same | Jeonghun Cho | 2021-11-09 |
| 11127663 | Semiconductor package having exposed heat sink for high thermal conductivity | — | 2021-09-21 |
| 10896889 | Multilayer clip structure attached to a chip | Young Hun Kim, Tae Heon Lee, Jeong Hun Cho | 2021-01-19 |