Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171074 | Heat sink board, manufacturing method thereof, and semiconductor package including the same | Yun Hwa CHOI | 2021-11-09 |
| 11056420 | Pressing-type semiconductor power device package | Yunhwa Choi, Jungtae Cho | 2021-07-06 |