Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107755 | Packaging for lateral high voltage GaN power devices | Yue Fu, Yan-Fei Liu | 2021-08-31 |
| 10939553 | Vertical-side solder method and package for power GaN devices | Yan-Fei Liu, Yue Fu, Wai Tung Ng | 2021-03-02 |
| 10892254 | Defect-tolerant layout and packaging for GaN power devices | Guanhou Luo, Yue Fu, Wai Tung Ng, Yan-Fei Liu | 2021-01-12 |