Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107755 | Packaging for lateral high voltage GaN power devices | Zhanming Li, Yan-Fei Liu | 2021-08-31 |
| 10939553 | Vertical-side solder method and package for power GaN devices | Zhanming Li, Yan-Fei Liu, Wai Tung Ng | 2021-03-02 |
| 10892254 | Defect-tolerant layout and packaging for GaN power devices | Zhanming Li, Guanhou Luo, Wai Tung Ng, Yan-Fei Liu | 2021-01-12 |