Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211370 | Bonded assembly with vertical power and control signal connection adjacent to sense amplifier regions and methods of forming the same | Jee-Yeon Kim, Fumiaki Toyama | 2021-12-28 |
| 11114459 | Three-dimensional memory device containing width-modulated connection strips and methods of forming the same | Takaaki Iwai, Hirofumi TOKITA, Yoshitaka Otsu, Fumiaki Toyama | 2021-09-07 |
| 11081443 | Multi-tier three-dimensional memory device containing dielectric well structures for contact via structures and methods of forming the same | Masayuki Hiroi, Fumiaki Toyama | 2021-08-03 |
| 11011209 | Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same | Jee-Yeon Kim, Kwang Ho Kim, Fumiaki Toyama | 2021-05-18 |
| 10903237 | Three-dimensional memory device including stepped connection plates and methods of forming the same | Naohiro Hosoda, Hiroyuki Ogawa | 2021-01-26 |