Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121111 | Semiconductor package structure and method of manufacturing the same | Yu-Pin Tsai, Ming-Chi Liu, Kai-Chiang Hsu, Che-Ting Liu | 2021-09-14 |
| 11088057 | Semiconductor package structure and method for manufacturing the same | Yu-Pin Tsai, Man-Wen TSENG | 2021-08-10 |