Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11121111 | Semiconductor package structure and method of manufacturing the same | Yu-Pin Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu | 2021-09-14 | $3,411,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11121111 | Semiconductor package structure and method of manufacturing the same | Yu-Pin Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu | 2021-09-14 | $3,411,000 |