Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183429 | Method of manufacturing a semiconductor device including forming a gate insulating material layer on a protection layer and removing the gate insulation material layer and the protection layer on the first region | Sung-Min Kang, Kyung Min Kim, Min-hee UH | 2021-11-23 |
| 11121127 | Integrated circuit chips, integrated circuit packages including the integrated circuit chips, and display apparatuses including the integrated circuit chips | Jun-Gu Kang, Woon-bae Kim, Dae-Cheol Seong, Yune-seok Chung | 2021-09-14 |
| 11049846 | Integrated circuit chip, method of manufacturing the integrated circuit chip, and integrated circuit package and display apparatus including the integrated circuit chip | Min-hee UH, Sung-Min Kang, Jun-Gu Kang, Seung-hee Go | 2021-06-29 |