Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088053 | Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same | Xilin Rao, Zhengguo Wen, Jianwei Yang, Yiwei Huang, Fangbiao Liu | 2021-08-10 |