Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088053 | Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same | Xilin Rao, Zhengguo Wen, Jianwei Yang, Yiping Si, Fangbiao Liu | 2021-08-10 |
| D920265 | Integrated circuit package | — | 2021-05-25 |