Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195813 | Anisotropic conductive film and production method of the same | Reiji Tsukao | 2021-12-07 |
| 11136476 | Method of producing anisotropic conductive film and anisotropic conductive film | Seiichiro Shinohara | 2021-10-05 |
| 11139629 | Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector | — | 2021-10-05 |
| 11049842 | Alignment method, method for connecting electronic component, method for manufacturing connection body, connection body and anisotropic conductive film | — | 2021-06-29 |
| 10943879 | Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure | Tomoyuki Ishimatsu | 2021-03-09 |