Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943879 | Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure | Yasushi Akutsu | 2021-03-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943879 | Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure | Yasushi Akutsu | 2021-03-09 |