Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088053 | Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same | Zhengguo Wen, Jianwei Yang, Yiwei Huang, Yiping Si, Fangbiao Liu | 2021-08-10 |