Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201081 | Method for separating thin layers of solid material from a solid body | Jan Richter | 2021-12-14 |
| 11004723 | Wafer production method | Jan Richter, Christian Beyer | 2021-05-11 |
| 10978311 | Method for thinning solid body layers provided with components | Marko Swoboda, Ralf Rieske, Christian Beyer, Jan Richter | 2021-04-13 |