Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930663 | Interconnect structure of three-dimensional memory device | Zhenyu Lu, Lidong Song, Yongna Li, Feng Pan, Steve Weiyi Yang | 2021-02-23 |
| 10923491 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2021-02-16 |
| 10910397 | Through array contact structure of three- dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2021-02-02 |
| 10886291 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2021-01-05 |