Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205702 | Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit | Christophe Figuet, Ludovic Ecarnot, Bich-Yen Nguyen, Daniel Delprat, Ionut Radu | 2021-12-21 |
| 11127624 | Method of manufacturing a semiconductor on insulator type structure, notably for a front side type imager | Oleg Kononchuk, Ludovic Ecarnot | 2021-09-21 |
| 11127775 | Substrate for front side type imager and method of manufacturing such a substrate | Oleg Kononchuk, Ludovic Ecarnot, Christelle Michau | 2021-09-21 |
| 10957577 | Method for fabricating a strained semiconductor-on-insulator substrate | Guillaume Chabanne, Nicolas Daval | 2021-03-23 |
| 10903263 | Front-side type image sensor and method for manufacturing such a sensor | — | 2021-01-26 |