Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10939553 | Vertical-side solder method and package for power GaN devices | Zhanming Li, Yan-Fei Liu, Yue Fu | 2021-03-02 |
| 10892254 | Defect-tolerant layout and packaging for GaN power devices | Zhanming Li, Guanhou Luo, Yue Fu, Yan-Fei Liu | 2021-01-12 |