Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114368 | Base material, mold package, base material manufacturing method, and mold package manufacturing method | Takumi Nomura, Kazuki KODA | 2021-09-07 |
| 10937711 | Electronic device and method for manufacturing same | Kazuki KODA | 2021-03-02 |