Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114368 | Base material, mold package, base material manufacturing method, and mold package manufacturing method | Takumi Nomura, Wataru Kobayashi | 2021-09-07 |
| 10937711 | Electronic device and method for manufacturing same | Wataru Kobayashi | 2021-03-02 |
| 10903399 | Method for manufacturing a light emitting device comprising at least two first light emitting diodes and a second light emitting diodes interposed therebetween | Seitaro Akagawa | 2021-01-26 |