Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127689 | Segmented shielding using wirebonds | Brian Howard Calhoun, W. Kent Braxton, Domingo Farias, Joseph Edward Geniac, Kyle Sullivan +1 more | 2021-09-21 |
| 11058038 | Electromagnetic shields for sub-modules | Kelly M. Lear, Jeffrey Miller, Jeffrey Dekosky | 2021-07-06 |
| 11024541 | Process for molding a back side wafer singulation guide | Neftali Salazar, Rommel Quintero | 2021-06-01 |
| 10905007 | Contact pads for electronic substrates and related methods | John August Orlowski, David Jandzinski | 2021-01-26 |
| 10888040 | Double-sided module with electromagnetic shielding | David Jandzinski, Brian Howard Calhoun | 2021-01-05 |