Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160171 | Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition | Kwang-Choon Chung, Jung Yoon Moon, Hyeon-Jun Seong, Byung Woong Moon | 2021-10-26 |
| 11089691 | Microcircuit forming method and etching fluid composition | Kwang-Choon Chung, Jung Yoon Moon, Sung In Ha, Byung Woong Moon | 2021-08-10 |