Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160171 | Circuit forming method using selective etching of electrically conductive metal this film seed layer and etching solution composition | Kwang-Choon Chung, Su Han Kim, Jung Yoon Moon, Hyeon-Jun Seong | 2021-10-26 |
| 11089691 | Microcircuit forming method and etching fluid composition | Su Han Kim, Kwang-Choon Chung, Jung Yoon Moon, Sung In Ha | 2021-08-10 |
| 10887997 | Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB | Kwang-Choon Chung | 2021-01-05 |