Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205575 | Method for stripping one or more layers from a semiconductor wafer | Byron Joseph Palla, Brian Edward Hornung, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2021-12-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205575 | Method for stripping one or more layers from a semiconductor wafer | Byron Joseph Palla, Brian Edward Hornung, Brian K. Kirkpatrick, Douglas Ticknor Grider | 2021-12-21 |