Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081468 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses | Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri | 2021-08-03 |