Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211347 | Integrated circuit structures and methods of forming an opening in a material | Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park | 2021-12-28 |
| 11081468 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses | Hiroki Fujisawa, Shunji Kuwahara, Mitsuaki Katagiri, Satoshi Isa | 2021-08-03 |
| 10943841 | Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate | Shigeru Sugioka, Kiyonori Oyu, Hiroshi Toyama, Jung Chul Park | 2021-03-09 |