Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127693 | Barrier for power metallization in semiconductor devices | Johann Gatterbauer, Katrin Albers, Joerg Busch, Klaus Goller, Norbert Mais +3 more | 2021-09-21 |
| 11031321 | Semiconductor device having a die pad with a dam-like configuration | Fortunato Lopez, Antonia Maglangit, Siti Amira Faisha Shikh Zakaria | 2021-06-08 |
| 10978395 | Method of manufacturing a semiconductor device having a power metallization structure | Ravi Keshav Joshi, Axel Bürke, Sven Schmidbauer, Michael Nelhiebel | 2021-04-13 |