Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069703 | Three-dimensional device with bonded structures including a support die and methods of making the same | Akio Nishida, Zhixin Cui | 2021-07-20 |
| 10923496 | Three-dimensional memory device containing a replacement buried source line and methods of making the same | Kenji Sugiura, Akio Nishida, Ryosuke Kaneko, Michiaki Sano | 2021-02-16 |
| 10892267 | Three-dimensional memory device containing through-memory-level contact via structures and method of making the same | Kenji Sugiura, Hisakazu Otoi, Shigehisa Inoue, Yuki Fukuda | 2021-01-12 |