Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11181704 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura | 2021-11-23 |
| 11112570 | Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump | Toyohiro Aoki, Takashi Hisada, Eiji Nakamura | 2021-09-07 |
| 10948659 | Integrated optoelectronic chip and lens array | Hidetoshi Numata | 2021-03-16 |
| 10914901 | Lateral mounting of optoelectronic chips on organic substrate | Jean Benoit Heroux | 2021-02-09 |