Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168234 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Sampath Purushothaman, Willi Volksen +1 more | 2021-11-09 |
MR
Mary E. Rothwell
Overall (2021): #342,866 of 548,734Top 65%
1
Patents 2021