Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168234 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Mary E. Rothwell, Willi Volksen +1 more | 2021-11-09 |
SP
Sampath Purushothaman
Overall (2021): #272,917 of 548,734Top 50%
1
Patents 2021