Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11200190 | Command based on-die termination for high-speed NAND interface | Gang Zhao, Wei Jiang, Jie Chen | 2021-12-14 |
| 11048654 | Systems and methods for providing multiple memory channels with one set of shared address pins on the physical interface | Shawn Chen, Wei Jiang | 2021-06-29 |
| 11043435 | Semiconductor die with hybrid wire bond pads | Gang Zhao, Wei Jiang, Shiann-Ming Liou | 2021-06-22 |