Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069535 | Atomic layer etch of tungsten for enhanced tungsten deposition fill | Chiukin Steven Lai, Samantha Tan, Anand Chandrashekar, Teh-Tien Su, Wenbing Yang +2 more | 2021-07-20 |