Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088060 | Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package | Jaekul Lee, Jinseon Park | 2021-08-10 |
JM
Junwoo Myung
Overall (2021): #387,027 of 548,734Top 75%
1
Patents 2021