Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121079 | Fan-out semiconductor package | Bongju Cho, Myungsam Kang, Younggwan Ko, Gun Lee | 2021-09-14 |
| 11088060 | Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package | Jinseon Park, Junwoo Myung | 2021-08-10 |